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Jack R. Barckhoff Welding Management Scholarship

American Welding Society Foundation, Inc.

This scholarship was established by Jack R. Barckhoff, P.E. founder and chief executive officer of Barckhoff Welding Management. Mr. Barckhoff has been passionately committed to pursuing the development and implementation of management tools to improve the productivity, quality, profitability and competitiveness of welding operations in companies across the United States. This scholarship aims to provide financial assistance to individuals planning to pursue a career in welding engineering at The Ohio State University.

Key Information

Eligibility Requirements

  • Age/Grade Level:
    Applicant must be a minimum of eighteen years of age; Applicant must be a junior currently enrolled in the welding engineering program at The Ohio State University; Seniors entering The Ohio State University graduate school in welding engineering will be considered if there are no qualified junior welding engineering candidates.
  • Minimum GPA:
    2.50
  • Financial Need:
    Not Mentioned
  • Other Academic Requirements:
    Applicant will be expected to enroll and complete the 2-hour credit course in Total Welding Management at The Ohio State University during his/her Junior or Senior Year.
  • Citizenship:
    Applicant must be a citizen of the United States of America
  • College:
    Applicant must be a junior currently enrolled in the welding engineering program at The Ohio State University.
  • Major/Career:
    Applicant must be a junior currently enrolled in the welding engineering program at The Ohio State University.

Application Details

  • Transcript:
    Required
  • Resume/Activity List:
    Not required
  • Essay:
    A 300-500 word essay on how they see their role once they have graduated in improving the world of welding and the welding industry in the United States and how will they use their education to improve the U.S. competitive position in welding and manufacturing.
  • Other Materials:
    A completed online application

Contact Information