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Chapter 1 Detroit Associate Scholarship

Society of Manufacturing Engineers (SME) Education Foundation

The 2016-2017 Chapter 1 Detroit Associate Scholarship is awarded to eligible high school senior and undergraduate students taking up manufacturing engineering technology, manufacturing engineering, or related courses. Eligible students have at least 3.0 GPA and be from the listed sponsored institutions.

Key Information

Eligibility Requirements

  • Age/Grade Level:
    Graduating high school senior or an undergraduate student
  • Minimum GPA:
    3.0
  • Financial Need:
    Not Required
  • Residence:
    Students with permanent residency status in the U.S. (i.e. green card) or Canada
  • Citizenship:
    Scholarships are only available to citizens of the U.S. and territories, citizens of Canada
  • College:
    An undergraduate student enrolled in a manufacturing engineering, manufacturing engineering technology or closely related degree at one of the following sponsored institutions:Wayne State University, Student Chapter S004Lawrence Technological University, Student Chapter S011University of Detroit-Mercy, Student Chapter S081Focus: Hope, Center for Advanced Technologies, Student Chapter S279Henry Ford Community College, Student Chapter S331Macomb Community College, Student Chapter S071University of Michigan - Dearborn, Student Chapter S326
  • Major/Career:
    Graduating high school senior or an undergraduate student enrolled in a manufacturing engineering, manufacturing engineering technology

Application Details

  • Transcript:
    Required
  • Resume/Activity List:
    Required
  • Essay:
    Student Statement include details about why you chose your major, education and career objectives, and how this scholarship will help you achieve your objectives.
  • Recommendation Letters:
    Reference Letters ask individuals who can attest to your qualifications to write a reference letter on your behalf. Be sure to get their email addresses, so you can include this contact information in your scholarship application.

Contact Information

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